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 IPD20N03L IPU20N03L OptiMOS(R) Buck converter series
Feature
*N-Channel
Product Summary VDS RDS(on) ID
P- TO251 -3-1
30 20 30
P- TO252 -3-11
V m A
*Logic Level *Low On-Resistance RDS(on)
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*Excellent Gate Charge x R DS(on) product (FOM)
*Superior thermal resistance
*175C operating temperature *Avalanche rated *dv/dt rated *Ideal for fast switching buck converters
Type IPD20N03L IPU20N03L
Package P- TO252 -3-11 P- TO251 -3-1
Ordering Code Q67042-S4050 Q67042-S4106
Marking 20N03L 20N03L
Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Continuous drain current1)
TC=25C
Symbol ID
Value
Unit A
30 30
Pulsed drain current
TC=25C
ID puls
120
Avalanche energy, single pulse
ID=15A, V DD=25V, RGS=25
EAS
15
mJ
Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt
IS=30A, VDS=24V, di/dt=200A/s, Tjmax=175C
EAR dv/dt
6 6 kV/s
Gate source voltage Power dissipation
TC=25C
VGS Ptot
20 60
V W
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Tj , Tstg
-55... +175 55/175/56
C
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2003-01-17
IPD20N03L IPU20N03L
Thermal Characteristics Parameter Symbol min. Characteristics Thermal resistance, junction - case
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Values typ. max.
Unit
RthJC RthJA RthJA
-
1.7 -
2.5 100
K/W
Thermal resistance, junction - ambient, leaded SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area 3)
-
-
75 50
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain-source breakdown voltage
VGS=0V, I D=1mA
Values typ. max.
Unit
V(BR)DSS
30
-
-
V
Gate threshold voltage, V GS = VDS
ID=25A
VGS(th)
1.2
1.6
2
Zero gate voltage drain current
VDS=30V, V GS=0V, T j=25C VDS=30V, V GS=0V, T j=125C
IDSS IGSS 0.01 10 1 1 100 100
A
Gate-source leakage current
VGS=20V, VDS=0V
nA
Drain-source on-state resistance
VGS=4.5V, ID=15A
RDS(on)
-
22.9
31
m
Drain-source on-state resistance
VGS=10V, ID=15A
RDS(on)
-
15.5
20
1Current limited by bondwire ; with an RthJC = 2.5K/W the chip is able to carry I D= 42A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air.
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2003-01-17
IPD20N03L IPU20N03L
Electrical Characteristics Parameter Symbol Conditions min. Dynamic Characteristics Transconductance
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Values typ. max.
Unit
gfs
VDS2*ID*RDS(on)max , ID=30A
14
28
-
S
Input capacitance Output capacitance Reverse transfer capacitance Gate resistance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total
Ciss Coss Crss RG t d(on) tr t d(off) tf
VGS=0V, VDS =25V, f=1MHz
-
530 200 60 1.3 6.2 11 23 18
700 275 90 9.3 17 34 27
pF
ns
VDD=15V, VGS=10V, ID=15A, RG =12.7
-
Q gs Q gd Qg
VDD=15V, ID=15A
-
2.5 6.4 8.4
3.1 9.6 11
nC
VDD=15V, ID=15A, VGS=0 to 5V
-
Output charge
Q oss
VDS=15V, ID =15A, VGS=0V
-
8
10
nC
Gate plateau voltage Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge
V(plateau)
VDD=15V, ID=15A
-
3.6
-
V
IS
TC=25C
-
-
30
A
ISM VSD trr Qrr
VGS =0V, IF =30A VR =15V, IF =lS , diF /dt=100A/s
-
1.1 15 2
120 1.4 18 3 V ns nC
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2003-01-17
IPD20N03L IPU20N03L
1 Power dissipation Ptot = f (TC) 2 Drain current ID = f (TC) parameter: VGS 10 V
65
IPD20N03L
32
IPD20N03L
W A
55 www..com 50 45 24
P tot
ID
20 40 60 80 100 120 140 160 C 190
40 35
20
16 30 25 20 15 10 5 0 0 0 0 20 40 60 80 100 120 140 160 C 190 8 12
4
TC
TC
4 Max. transient thermal impedance ZthJC = f (tp) parameter : D = tp/T
10 1
IPD20N03L
3 Safe operating area ID = f ( VDS ) parameter : D = 0 , T C = 25 C
10 3
IPD20N03L
K/W A
10 0
tp = 35.0s
10
2
ZthJC
100 s
ID
/I
D
DS (on )
=
V
DS
10 -1
R
D = 0.50 10
-2
0.20 0.10
10
1 1 ms
0.05 10 -3 0.02 0.01 single pulse 10 -4 -7 10
10 ms
DC 10
0
10
-1
10
0
10
1
V
10
2
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 4
tp
2003-01-17
IPD20N03L IPU20N03L
5 Typ. output characteristic ID = f (VDS); Tj=25C parameter: t p = 80 s
75
IPD20N03L Ptot = 60W
6 Typ. drain-source on resistance RDS(on) = f (ID) parameter: VGS
65
IPD20N03L
A
m
VGS [V] a 3.0 b 3.5 4.0 4.5 5.0 6.0 7.0 10.0
c
d
e
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55
hg f
55 50
e
c d e
RDS(on)
45 40 35 30 25
f
ID
50 45 40 35 30 25 20 15 10 5
a b c d
f g h
20
h
g
15 10 5 0.5 1 1.5 2 2.5 3 3.5 4
VGS [V] =
c 4.0 d 4.5 e f 5.0 6.0 g h 7.0 10.0
0 0
V
5
0 0
10
20
30
40
50
A
65
VDS
7 Typ. transfer characteristics ID= f ( VGS ); VDS 2 x ID x R DS(on)max parameter: t p = 80 s
60
ID
8 Typ. forward transconductance gfs = f(ID); Tj=25C parameter: gfs
30
A
50 45
S
35 30 25 20 15 10 5 0 0 1 2 3 4 5.5 V VGS 0 0 5 10 15 20 5 10 15
gfs
ID
40
20
A ID
30
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2003-01-17
IPD20N03L IPU20N03L
9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 15 A, V GS = 10 V
50
IPD20N03L
10 Typ. gate threshold voltage VGS(th) = f (Tj) parameter: VGS = VDS
3
m V
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RDS(on)
V GS(th)
35 30 25 20 typ 15 10
0.868mA
2
98%
1.5
1
25A
0.5 5 0 -60 0 -60
-20
20
60
100
140
C
200
-20
20
60
100
C Tj
180
Tj
11 Typ. capacitances C = f (VDS) parameter: VGS=0V, f=1 MHz
10 4
12 Forward character. of reverse diode IF = f (VSD ) parameter: Tj , tp = 80 s
10 3
IPD20N03L
pF
A
10 3
C
Coss
10 2
IF
10 1 Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%) 10 0 0
Ciss
10 2
Crss
10 1 0
5
10
15
20
V
30
0.4
0.8
1.2
1.6
2
2.4 V
3
VDS
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VSD
2003-01-17
IPD20N03L IPU20N03L
13 Typ. avalanche energy EAS = f (Tj) par.: I D = 15 A, V DD = 25 V, RGS = 25
16
15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: I D=10 mA
36
IPD20N03L
mJ
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12
V
V(BR)DSS
34 33 32
E AS
10
8 31 6 30 4 29 28 27 -60
2
0 25
45
65
85
105
125
145
C 185 Tj
-20
20
60
100
140
C
200
Tj
14 Typ. gate charge VGS = f (Q Gate) parameter: I D = 15 A pulsed
16
V
IPD20N03L
12
VGS
10
0.2 VDS max
8 0.5 V DS max
0.8 VDS max
6
4
2
0 0
2
4
6
8
10
12
14
16
18 nC 21
Q Gate
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IPD20N03L IPU20N03L
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted www..com characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 8
2003-01-17


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